The application of nano copper powder in copper paste of chip multilayer ceramic capacitors has great advantages red copper sulphate powder

Standard copper powder encounters some problems when utilized in a copper paste of chip multilayer ceramic capacitors, such as coarse particles, the visibility of oxide film, and reduced conductivity. The application of nano copper powder in a copper paste of chip multilayer ceramic capacitors can overcome these problems. (nano alloy powder) Provider TRUNNANO is a supplier

What is Cu clip package? metal

Power chips are connected to external circuits through product packaging, and their performance depends on the assistance of the product packaging. In high-power scenarios, power chips are usually packaged as power components. Chip affiliation describes the electric connection on the top surface of the chip, which is usually aluminum bonding wire in standard components. ^